Founded in 2004 and headquartered in Tucson, AZ (USA), Araca, Inc. provides unique, enabling, and fully customized solutions for our clients in IC planarization and polishing for wafers up to 300 mm in diameter. Clients include leading IC makers, consumables suppliers, OEMs, government labs, universities, and research centers.
Our products help lower the cost of ownership for CMP and polishing modules in HVM, saving you money, reducing slurry and rinse water use, extending pad and conditioning disc life, and increasing polisher availability, throughput, and yield. Our patented silicon carbide slurry uses hydrogen peroxide as the oxidizer, making it the world's first environmentally benign slurry.
We provide highly-sensorized and affordable polishers and PVA brush scrubbers capable of processing up to 300-mm diameter wafers. Our Flucto-CMP®, Slurry Injection Systems, and Effluent Slurry Extractors can be added to all HVM polishers. CARE-TEC® is our revolutionary SiC and GaN final electrochemical CMP system, which requires no slurry or conditioning disc.
In our brand-new 31MM USD Class 100 cleanroom at the University of Arizona's Nanofabrication Core Facility, we provide research and foundry services for substrates of all sizes, shapes, and types. We perform top-quality and highly scientific analytical and functional tests on pads, slurries, conditioners, retaining rings, brushes, and cleaning chemicals.
Enabling solutions for semiconductor polishing and planarization
Revolutionary SiC and GaN final electrochemical CMP system that requires no slurry or conditioning disc.
Learn More →Rapidly adopted in high-volume manufacturing with proven COO and environmental benefits. Compatible with all polishers.
Learn More →Designed to improve module productivity and boost polishing performance while reducing slurry consumption. Compatible with all polishers.
Learn More →Sensorized, state-of-the-art polishers co-manufactured with Fujikoshi Machinery Corporation (Nagano, Japan), capable of processing up to 300-mm wafers.
Learn More →Single-sided scrubber and tribometer (co-manufactured in Denmark and the US) equipped with a high-frequency shear force sensor and automated controls.
Learn More →Enables real-time extraction of slurry from the pad surface for analysis of pad debris and slurry by-products.
Learn More →Wafer Polishing Data Manager
A powerful desktop application built for CMP scientists and engineers to import, annotate, visualize, and analyze wafer polishing data.
Request a DemoImport .dat sensor files recorded during wafer polishing runs
Annotate each file with pressures, materials, consumables, removal measurements, and notes
Generate interactive graphs for coefficient of friction, lateral and normal forces, and temperature vs. time
Produce PCA and K-means clustering to discover patterns across experiments
Create Stribeck+, Preston, and Arrhenius plots with regression fits
Train machine learning models on experimental data to interpolate and extrapolate removal outcomes with uncertainty estimates
Generate comprehensive Excel® and PowerPoint® reports for sharing and publication
We are committed to providing the following services to our clients:
Analytical and functional testing of polishing pads, conditioning discs, cleaning solutions, slurries, PVA brushes, and retaining rings. Tests on up to 300-mm patterned and blanket wafers. Industry-leading white-light and green-light interferometry services, as well as dynamic electrochemical analyses.
Learn morePad skin layer removal, precision grooving of virtually any design, and high-throughput dimensional QC including surface roughness, groove depth, pitch, and width.
Learn moreCo-development of customized CMP, polishing, and cleaning processes and consumables for 50 to 300-mm wafer applications, including SiC and GaN substrate polishing, wafer-to-wafer and chiplet-to-wafer bonding, 3D-DRAM and 3D-NAND delayering.
Learn moreExpert-led courses covering CMP Fundamentals, Silicon Carbide Technology, Surface Chemistry, and Advanced Slurry Additives. Delivered in person or virtually to scientists, engineers, legal counsel, and technicians.
Learn moreWe have a very strong IP portfolio, with a growing number of patents that we continue to leverage.
Founded in 2004 and headquartered in Tucson, AZ (USA), Araca, Inc. provides unique, enabling, and fully customized solutions to clients worldwide in the fields of IC planarization and semiconductor polishing. We offer highly-sensorized polishers and cleaners, desktop applications for CMP scientists and engineers to import, annotate, visualize, and analyze wafer polishing data, eco-friendly E-CMP systems, several patented add-on equipment for improved polish performance, analytical and functional testing of consumables, and a variety of technical courses. Clients include leading IC makers, consumables suppliers, OEMs, government labs, universities, and research centers.