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Analytical and Functional Testing

We analytically and functionally test all types of polishing pads, diamond discs, cleaning solutions, proprietary additives to slurries or cleaning solutions, and retaining rings. Wherever feasible, test results are supported by sound scientific analysis.

Our Analytical Services Include

  • Pad microtexture, asperity density, and radius of curvature determination via white light and green light interferometry.
  • Pad surface imaging and elemental analysis via SEM and EDX.
  • Retaining ring microtexture determination via white light and green light interferometry.
  • Pad surface imaging via SEM.
  • Diamond height determination and disc surface imaging via white light, green light interferometry, and SEM.
  • Dissolved oxygen concentration determination in slurries and cleaning solutions.
  • Full dynamic electrochemical analysis for open circuit potential and corrosion current analysis in slurry-wafer-pad systems.
  • Diamond-induced furrow depth analysis.

Functional Testing

In addition to analytical services, we offer a wide range of cost-effective functional tests of your consumables, which allow us to make recommendations on their performance before your company commits additional funds for full-scale testing at larger CMP foundries, tool suppliers, and end-users. These tests are intended to:

Early-Stage Screening Identify promising materials (and screen out potentially bad actors) during the early stages of product development.
Failure Analysis & Diagnostics Failure analysis and diagnostics.
QA & QC Baselines Establish material performance baselines for QA and QC.
IP & Publications Support Provide data to assist you in IP filings, technical publications, or presentations to clients.

Unique Capabilities

Several unique capabilities in the coupon-to-300-mm arenas set us apart in the industry. These include our ability to:

01 Analyze and determine the mechanisms of retaining ring, pad, and diamond disc wear.
02 Establish the tribological attributes of planarization and polishing processes.
03 Determine, experimentally and theoretically, the kinetics of material removal in various CMP processes.
04 Determine, through real-time high-speed videography, average slurry film thicknesses and flow patterns during polishing.

Related Links

Reliable and Fast Inline CMP Slurry Analysis Based on the Refraction of Light Let us Test your Advanced CMP Consumables! Araca, Inc.’s UVIZ-100® for Characterizing Fluid Flow in CMP Our “Stribeck+” Curve Needs a Companion! Rapid Assessment of Lubrication in CMP via “Stribeck+” Curves CMP Conditioning Disc Break-in and Pad Wear Rate Measurements Pad Conditioning Recipe Optimization Services by Araca, Inc. CMP and Old Italian Violins – The Effect of Directivity More on Directivity and Copper CMP Inferences of Slurry Bow Wave Width Due to Different Retaining Ring Designs from COF and Directivity Data Top-Notch Analytical and Functional Testing of CMP Pads The Wrong Type of CMP Retaining Ring can be a Yield-Killer!
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Need Analytical or Functional Testing?

Contact us to discuss our testing capabilities and determine how we may assist you with your CMP consumables evaluation needs.

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