The patent-pending Flucto-CMP® significantly reduces polishing defects and slurry consumption for selected CMP and substrate polishing processes. Eight units have been sold thus far which are being beta-tested on 200- and 300-mm AMAT, Ebara, and Accretech polishers. Flucto-CMP® is intended for metal, STI, hardmask and SiC CMP applications.
Up to 80% lower wafer-level defects.
Up to 30% lower dishing and erosion.
Up to 50% lower lateral and normal vibrations.
Up to 5X modulation in Ta-to-Cu removal rate selectivity.
Up to 50% higher removal rates at the same polishing pressure resulting in shorter polish times and less slurry consumption.
Up to 40% lower polishing pressures while maintaining the same removal rate (low-stress polishing).
Available with 950 or 450 kHz transducers, Flucto-CMP® provides on-demand off-the-shelf slurry activation using megasonic waves through a simple add-on device to existing polishers. The resulting energy generates excess reactive sono-activated species (RSAS) upstream of the polisher. The activated species in the slurry live for several minutes which is enough for them to be chemically effective. For slurries that contain hydrogen peroxide, APM, or KMnO4, the species are mostly a mixture of OH radicals and superoxide anion radicals.
For Cu, with excess RSAS at hand, the rigidity of the passivation layer that is formed via Flucto-CMP® is reduced as strong coordination bonding between Cu and BTA is avoided. This modified film provides sufficient passivation from adverse corrosion processes which can be removed at a higher rate and reduced mechanical load (i.e., the complete realization of low-stress polishing). For other metals, the above mechanism also holds as we have shown that passivation layers formed via Flucto-CMP® are softer thereby allowing material removal at lower than usual pressures.
In the case of STI, RSAS are in the form of ceria nano-particles with a higher ratio of Ce3+ to Ce4+ on their surface. This is due to the fact that sonication increases the amount of Ce3+ on the nano-particle surface which increases removal.
Flucto-CMP® is comprised of a variable-volume megasonic reactor, power supply, and an optional PC. Detailed instructional and installation videos are included with each unit sale. Flucto-CMP® can be installed and used as a stand-alone unit or integrated with the polisher electronics for seamless operation. The system can also be used in tandem with the Araca SIS® for even better overall performance.
Manufactured jointly by ProSys (Campbell, CA) and Araca, Flucto-CMP® is warrantied for one year. The megasonic transducer has an estimated life of at least two years, after which it will need to be replaced (minimal effort required).
Direct-to-Consumer (D2C).
To OEMs for integration with polishers.
OEM licenses available for sale.
Contact us to schedule a beta test at your site and determine how Flucto-CMP® may reduce your overall COO by saving slurry while increasing the overall yield of your CMP or polishing module. We also have advanced ROI simulation models which we can share with you after our initial engagement.
Contact Us