In an exclusive partnership with our strategic corporate investor, Fujikoshi Machinery Corporation (Nagano, Japan), we manufacture top-notch, state-of-the-art polishers for processing coupon-sized wafers up to 300 mm. Our highly reliable systems are capable of real-time measurement, analysis, correlation, and reporting of shear and normal forces. The polishers are also capable of reporting the pad surface temperature in real time.
Less than 3% WIW (5-mm EE) and RTR non-uniformity.
Two built-in, 20-liter, and fully automated, slurry delivery systems.
Smallest footprint in the industry for both RDP-500® and APD-800®.
Coupon-sized all the way up to 300-mm wafers.
Multiple normal force, shear force, and infrared sensors tied to big data analytics software.
Easy to install with no raised-floor requirements.
The single-platen APD-800 Prime®, our flagship product, is suitable for processing 200- and 300 mm wafers. It is equipped with 1,000 Hz shear and normal sensors, an adjustable pad surface temperature sensor, air cylinder-actuated wafer and diamond conditioner downforce assemblies, and an advanced quick-disconnect oscillating wafer carrier with two independent zones for the wafer and another zone for the retaining ring (separate carriers for each wafer size come standard with the tool). Additionally, the polisher has two independent, computer-controlled slurry or chemical delivery systems, rapid platen heating and cooling, and a multi-zone diamond conditioning arm that mimics the dwell times and travel zones of an AMAT Reflexion LK®.
The single-platen RDP-500® system is suitable for processing coupon-sized wafers up to 200 mm. All of its features and functions are identical to those of its elder sibling. Reynolds numbers, as well as the multi-zone diamond conditioning arm, mimic those of an AMAT Mirra®.
Both polishers are powered by our FSX® proprietary force acquisition and data analysis system, featuring a superb GUI that includes calibration, data acquisition, waveform analysis, Stribeck+ analysis, endpoint detection (based on COF, shear force, or normal force), spectral analysis, directivity analysis, and several data correlation menus. The polishers and tribometers are intended for use in research and development environments at universities, research institutes, and consumables suppliers worldwide. They have proven crucial for slurry, pad, retaining ring, and conditioning disc QC applications that require functional tests. The same applies to 3D NAND and 3D DRAM delayering for failure analysis. Currently, there are 20+ APD-800 Prime® and 70+ RDP-500® polishers in the field worldwide.
By providing standardized, affordable polishers and tribometers to the CMP, silicon, and wide-bandgap material polishing communities, we are accelerating the acquisition and sharing of fundamental knowledge among stakeholders on common experimental platforms. We’re scaling up our large wafer-sized R&D systems because studies show that using smaller wafers can produce thermal, kinetic, and tribological results that aren’t representative of real-life conditions and can be misleading.
On both platforms, within-wafer removal rate non-uniformities (WIWRRNUs) for most processes are below 3 percent (1 sigma, 5-mm EE). Run-to-run non-uniformity values of average removal rate, WIWRRNU, average shear force, average downforce, and average pad temperature are all less than 2 percent.
Please refer to the APD-800 Prime® and RDP-500® brochures above for details on the tools’ features and capabilities, as well as our latest product specifications. Please feel free to contact us with any questions.
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