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Issued Patents

12 patents issued

Pending Patents

20 applications across multiple jurisdictions

CMP Slurry Processing — Family I

  • Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the same
    PCT Patent Application No. PCT/US22/40147 — WIPO Publication No. WO2023/149925 A1
  • Taiwan Patent Application No. 111130813
  • Singapore Application No. 11202404939V
  • US Patent Application No. 18/832,677
  • European Application No. 22925190.5
  • Korea Application No. 10-2024-7027917
  • Japan Application No. 2024-546406

CMP Slurry Processing — Family II

  • Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the same
    PCT Patent Application No. PCT/US22/15424 — WIPO Publication No. WO2022/177767
  • Taiwan Patent Application No. 111104889
  • Singapore Application No. 11202305805V
  • US Patent Application No. 18/275,355
  • European Application No. 22756709.6
  • Korea Application No. 10-2023-7026739
  • Japan Application No. 2023-574110

SiC Wafer Polishing

  • Silicon carbide (SiC) wafer polishing with novel slurry formulations and processes
    PCT Patent Application No. PCT/US22/28536 — WIPO Publication No. WO2022/240842
  • Taiwan Patent Application No. 111117791
  • European Patent Application No. 22808180.8
  • Singapore Patent Application No. 11202308325W
  • Korea Patent Application No. 10-2023-7043015
  • Japan Patent Application No. 2023-570300

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