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Facilities and Toolsets

Cleanroom laboratories, manufacturing facilities, and state-of-the-art metrology equipment across multiple locations.

Infrastructure

Our Facilities

Research Laboratory
Class 100 Cleanroom
1,200 sq-ft
Located at the Core Facilities, Nano Fabrication Center within the campus of the University of Arizona in Tucson. We own multiple 200- and 300-mm CMP tools, post-CMP PVA brush scrubbers, thin-film metrology systems, high-speed fluid-flow visualization systems, megasonics reactors, slurry mixing and handling equipment, and a well-equipped wet-chemistry lab. We have a long-term “Facilities Use Agreement” with the university, granting us permission to use the facility.
ITAR Compliant
Class 100 ITAR Cleanroom
600 sq-ft
Located at the Core Facilities, Nano Fabrication Center within the campus of the University of Arizona in Tucson. Access to technical data is restricted to US citizens, lawful permanent residents, or protected individuals. Secure handling of technical data (drawings, specs, and software) across all digital systems, preventing access by foreign nationals. Secure handling and storage of customers’ wafers.
Low-Volume Manufacturing
Class 10,000 Cleanroom
600 sq-ft
Located at the Core Facilities, Nano Fabrication Center within the campus of the University of Arizona in Tucson. This is where we manufacture and assemble our Slurry Injection and the Effluent Slurry Extractor systems. Flucto-CMP® is also assembled here. We own well-equipped incoming and outgoing QC stations for parts, as well as workbenches for systems assembly, laser scribing, and vacuum packaging.
Owned & Operated

Major Pieces of Equipment Owned by Araca

APD-800 Prime® Polisher and Tribometer Brochure (for processing 200 and 300 mm wafers – to be installed in late 2024).
APD-800® polisher and tribometer (for processing 200 and 300 mm wafers) – Please see CMP Polishers and Tribometers as well as APD-800® Polisher and Tribometer Brochure.
RDP-500® polisher and tribometer (for processing coupons, 100, 150 and 200 mm wafers) – Please see CMP Polishers and Tribometers as well as RDP-500® Brochure.
PCC-300 PVA brush scrubber and tribometer (for processing coupons, 100, 150, 200 and 300 mm wafers) – Please see PCC-300® Brochure and Heavy Table and Environmental Chamber System Brochure.
Automated 4-point probe for thickness measurement of thin metal films and wafer film thickness mapping (for processing coupons, 100, 150, 200 and 300 mm wafers).
Automated reflectometer for thickness measurement of thin insulator films and wafer film thickness mapping (for processing coupons, 100, 150, 200 and 300-mm wafers).
Four Flucto-CMP® continuously flowing slurry reactors with dedicated megasonic sapphire transducers, power supplies and electronics.
Two miniaturized Flucto-CMP® continuously flowing slurry reactors with dedicated megasonic sapphire transducers, power supplies and electronics.
High-speed fluid flow visualization system with UV light illumination.
High-Speed fluid flow visualization system with LED light illumination.
Keyence VR-6200 White Light Interferometer.
VITREK Proforma 300i capacitance-based system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers.
Digital microbalance for SiC RR determination.
Partnerships

Other Resources

Besides our own laboratory, manufacturing facility and all pieces of equipment therein, for a nominal pay-as-you-use basis, we have access to several key pieces of testing and metrology equipment within the campus of the University of Arizona.

University of Arizona
Pay-as-you-use access · Tucson, AZ
The metrology tools reside in various departments within the university (all less than 5-minute walking distance) such as Optical Sciences, Chemistry, Materials Science and Engineering, and Electrical and Computer Engineering:
Veeco white light interferometer.
Automated 4-point probe for thickness measurement of thin metal films and wafer mapping (200, 150 and 100 mm wafers, and coupons).
Automated reflectometer for thickness measurement of thin insulator films and wafer mapping (200, 150 and 100 mm wafers, and coupons).
Lewis University
5-year strategic collaboration
We have executed a 5-year strategic collaboration agreement with Lewis University that is focused on CMP and post-CMP cleaning process-equipment-materials pathfinding. We have donated more than 750K USD worth of CMP equipment to partially support activities within the Keleher Research Group at LU. The agreement gives us free-of-charge access to various experimental and metrology tools such as:
RDP-500 polisher and tribometer (for processing coupons, 100, 150 and 200 mm wafers) – Please see RDP-500® Brochure.
Post-CMP Scrubber and Tribometer (for processing coupons, 100, 150, 200 and 300 mm wafers) – Please see PCC-300® Brochure and Heavy Table and Environmental Chamber System Brochure.
Flucto-CMP® continuously flowing slurry reactor with dedicated megasonic sapphire transducer, power supply and electronics.
Miniaturized Flucto-CMP® continuously flowing slurry reactor with dedicated megasonic sapphire transducer, power supply and electronics.
SEM and EDX tool JEOL NeoScope JCM-7000.
Dark-field fluorescence microscopy.
Mavlipa G3.
A NanoSurf Flex atomic force microscopy.
Rotating Disk Electrode (Static and Dynamic).
Electrochemical Quartz Crystal Nano-balance (EQCN).
Spectroscopy and Surface Energy Analyses tools for UV/Visible spectroscopy, Ce4+/Ce3+ Analysis, oxygen radical trapping, Cu complex analysis, integrating sphere assembly for bandgap measurements, fluorescence spectroscopy, ATR/IR spectroscopy, AA spectroscopy, and dynamic contact angle analysis.
Lumina AT-1 laser optical scanning systems enable full-surface defect detection, mapping, and classification on transparent, translucent, and opaque substrates.
The following press releases describe our relationship with LU. All work that supports Araca's long-term strategic objectives is performed under iron-clad NDAs signed by Prof. Keleher and his students:
Araca, Inc. and Lewis University Partner on CMP Process Development Araca, Inc. and Lewis University Enter into a Five-Year Partnership to Further Advance Planarization Technology
Toho Koki Seisakusho Co., Ltd.
Pay-per-use access · Yokkaichi, Japan
Based on our recent agreement with Toho Koki Seisakusho Co., Ltd., we have negotiated unlimited access (on a pay-per-use basis) to their brand-new and ultra-modern Class 10 cleanroom in Yokkaichi (JP) as well as the following top-notch equipment therein:
Rigaku TXRF 3800e (Total reflection X-ray fluorescence)
Lasertec SICA6XD (SiC wafer inspection and review system)
ZYGO New View 6300 (Optical profilometer)
JFE Techno FiDiCa (Thickness distribution measurement device)