Process and Consumables Co-Development

We have been working closely with our clients to co-develop customized CMP, polishing and cleaning processes and consumables for 50 to 300 mm applications. Co-development is at times performed entirely at the customers’ sites using their processing and metrology equipment with specific inputs from our scientists on the incorporation of best-known methods (BKMs). Co-development can also initially take place at Araca Inc. using our equipment and BKMs followed by tech-transfer to our customers.

Please refer to our Pad Functional Testing Services Brochure as an example of what we have done on pad functional testing.

Our co-development activities have so far been in the following areas:

Novel pads, retaining rings and conditioning discs.
Customized copper, tungsten, tantalum and titanium planarization.
DRAM and 3D NAND structure delayering via CMP.
Through Glass Via (TGV) planarization and polishing.
Totally out of the box, and disruptive, work for next generation planarization applications.
Silicon carbide and GaN substrate polishing.

Please contact us for a free consultation on how we may be able to assist you in reaching your process and consumables development objectives.