Services

This is our second BU. We are committed to providing the following services to our clients:

Analytical and functional testing of consumables such as pads, diamond discs, retaining rings, PVA brushes, slurries, and post-CMP cleaning solutions.
3D NAND and DRAM chip delayering for failure analysis and assessment of the goodness of the etch and deposition processes as a function of depth into the chip.
Pad surface preparation and grooving, as well as high-throughput pad dimensional QC such as surface roughness, groove depth, pitch and width.
Low and medium-volume foundry services for substrates of all types and sizes.
Co-development of consumables and processes for a variety of CMP, polishing, chip delayering and cleaning applications.