Tel: 520.465.1419 E-mail : araca@aracainc.com
logo

Licensing

This is Araca’s third BU. We are a technology company. In fact, over the years, more than 15 percent of our revenues has been devoted to research and innovation related to our add-on systems, polishing and scrubbing equipment, H2O2-based SiC slurries, and various analytical and functional methods. As a result, we have a very strong IP, and a growing portfolio of patents as noted below:

Pending Patents

  • Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the same, PCT Patent Application No. PCT/US22/40147 – WIPO Publication No. WO2023/149925 A1.
  • Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the same, Taiwan Patent Application No. 111130813.
  • Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the same, Singapore Application No. 11202404939V.
  • Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the same, US Patent Application No. 18/832,677.
  • Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the same, European Application No. 22925190.5.
  • Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the same, Korea Application No. 10-2024-7027917.
  • Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the same, Japan Application No. 2024-546406.
  • Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the same, PCT Patent Application No. PCT/US22/15424 – WIPO Publication No. WO2022/177767.
  • Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the same, Taiwan Patent Application No. 111104889.
  • Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the same, Singapore Application No. 11202305805V.
  • Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the same, US Patent Application No. 18/275,355.
  • Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the same, European Application No. 22756709.6.
  • Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the same, Korea Application No. 10-2023-7026739.
  • Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the same, Japan Application No. 2023-574110.
  • Silicon carbide (SiC) wafer polishing with novel slurry formulations and processes, PCT Patent Application No. PCT/US22/28536 – WIPO Publication No. WO2022/240842.
  • Silicon carbide (SiC) wafer polishing with novel slurry formulations and processes, Taiwan Patent Application No. 111117791.
  • Silicon carbide (SiC) wafer polishing with novel slurry formulations and processes, European Patent Application No. 22808180.8.
  • Silicon carbide (SiC) wafer polishing with novel slurry formulations and processes, Singapore Patent Application No. 11202308325W.
  • Silicon carbide (SiC) wafer polishing with novel slurry formulations and processes, Korea Patent Application No. 10-2023-7043015.
  • Silicon carbide (SiC) wafer polishing with novel slurry formulations and processes, Japan Patent Application No. 2023-570300.

Issued Patents

  • “Silicon carbide (SiC) wafer polishing with novel slurry formulations and processes”, United States Patent No. 12,448,545
  • “Method and device for the injection of chemical mechanical planarization slurry”, United States Patent No. 9,296,088
  • “Method and device for the injection of chemical mechanical planarization slurry”, United States Patent No. 8,845,395
  • “Method and device for the injection of CMP slurry”, Taiwanese Patent No. I486,233
  • “Method and device for the injection of CMP slurry”, Japanese Patent No. 5,574,597
  • “Method and device for the injection of CMP slurry”, Korean Patent No. 1,394,745
  • “Method and device for the injection of chemical mechanical planarization slurry”, United States Patent No. 8,197,306
  • “Displacement measurement method in a confocal microscopy pad sample holder and method of using same”, United States Patent No. 7,869,027
  • “Confocal microscopy pad sample holder and method of using same”, United States Patent No. 7,839,496
  • “Removable polishing pad for chemical mechanical planarization”, United States Patent No. 7,727,052
  • “Method of determining the number of active diamonds on a conditioning disk”, United States Patent No. 7,410,411
  • “Method of determining the number of active diamonds on a conditioning disk”, Japan Patent No. 5,055,053

Exclusive and a very limited number of non-exclusive (regional and worldwide) distribution, sales and manufacturing licenses for all of the above patents and pending patents are currently available for sale to interested parties.

Please contact us for more information on the above as well as licensing terms and conditions.