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As part of our foundry services, in our state-of-the-art Class 100 cleanroom, we develop turn-key processes and run batches of up to 200 substrates per job, through various polishing, cleaning and metrology steps.

Wafer sizes range from 50 to 300 mm in diameter. End-user applications include 3D packaging, LEDs on GaN substrates, displays and MEMS.

Please contact us so that we can discuss ways that we may be able to process your wafers through various unit operations in our facility.