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Bottling the Pad: CMP without Pads or Conditioners

Bottling the Pad: CMP without Pads or Conditioners

Posted in : Uncategorized on by : Ara Philipossian
  • In conventional CMP, asperities on the pad surface contact the wafer, and with the assistance of polishing with slurry containing chemistry and abrasive particles, remove material from the wafer surface. Because polyurethane (PU) pad asperities are irreversibly deformed due to ..

    Modifying your CMP tool to run 450 mm wafers

    Modifying your CMP tool to run 450 mm wafers

    Posted in : Uncategorized on by : Ara Philipossian
  • As highlighted in an earlier blog by Dr. Len Borucki, our research team has investigated several key questions resulting from CMP wafer size scale-up by simulating hypothetical 300 and 450 mm processes on rotary polishers. Here, I’d like to describe ..

    CMP at 450 mm: Slurry use and thermal predictions. How did we do?

    CMP at 450 mm: Slurry use and thermal predictions. How did we do?

    Posted in : Uncategorized on by : Len Borucki
  • The Solid State Technology Article In the December 2009 issue of Solid State Technology, along with my co-authors Ara Philipossian of the University of Arizona and Araca Incorporated, and Michael Goldstein of Intel, I published an article projecting what might ..