In exclusive partnership with our corporate investor, Fujikoshi Machinery Corporation (Nagano, Japan), we manufacture state-of-the-art polishers for 100, 150, 200 and 300 mm diameter wafers.
The single-platen APD-800 system, our flagship product, is suitable for processing 200 and 300 mm wafers. It is equipped with high-frequency (1,000 Hz) shear force and down force sensors, removable platen mechanism (for easy and non-destructive pad changes), adjustable pad surface temperature sensor, air cylinder actuated wafer and diamond conditioner down force assemblies, multi-zone diamond conditioning arm, four independent computer-controlled slurry or chemical delivery systems, and a myriad of other standard features. The system is powered by Araca’s FSX proprietary force acquisition and data analysis system, with a superb GUI including calibration, data acquisition, waveform analysis, end-point detection, spectral analysis and correlation menus.
The single-platen RDP-500 system is suitable for processing 100, 150 and 200 mm wafers. It also is equipped with low-frequency (5 Hz) shear force and down force sensors, removable platen mechanism (for easy and non-destructive pad changes), adjustable pad surface temperature sensor, air cylinder actuated wafer and diamond conditioner down force assemblies, multi-zone diamond conditioning arm. The system comes with one independent computer-controlled slurry delivery system. The system allows for process data to be imported after the completion of a run for off-line analysis.
Both systems are intended for use in research and development environments at universities, research institutes and consumables suppliers worldwide. It has proven to be indispensable for slurry and conditioning disc QC applications where functional tests are required.
By providing a standardized and affordable polisher to the CMP and silicon polishing communities, we are significantly enhancing the rate at which fundamental knowledge is acquired and shared among various stakeholders on common experimental platforms. Our quest in proliferating our large wafer size R&D system is based on several studies which show that using wafers of smaller size (i.e. 100 mm or less) yield thermal, kinetic and tribological results that are not representative of real-life situations, and can quite often be misleading.
Within-wafer removal rate non-uniformity (WIWRRNU) for most processes are less than 5 percent (1-sigma, 5 mm edge exclusion). Run-to-run non-uniformity values of average removal rate, WIWRRNU, average shear force, average down force and average pad temperature are less than 2 percent.
Please contact us with any questions.