Tel: 520.270.8086 E-mail : araca@aracainc.com

Announcements

  • July 2016 – Araca signs up its third high volume manufacturing (HVM) slurry injection system customer (on 4 Strasbaugh 6EC® polishers).
  • April 2016 – WFT–100 (water filled template) is introduced. The product helps in improving RRWIWNU for 150 and 200-mm HVM polishers.
  • October 29-30, 2015 – Araca presents at CMP Users Group, Regensburg, Germany.
  • September 2015 – Araca exhibits and presents at the International Conference on Planarization/CMP Technology 2015 (ICPT 2015), Phoenix, AZ USA.
  • May 2015 – Araca introduces new services in the area of high throughput QC for pad groove dimensional analysis and pad surface roughness using Toho Engineering’s patented INS-800 pad and groove profiling machine.
  • March 2015 – RDP-500 is introduced as an improvement (and a replacement for) the APD-500 polisher for processing 50 to 200 mm diameter wafers (including SiC and GaN substrates). As always, the machine is compact and capable of real-time measurement, analysis, correlation and reporting of force in 3 dimensions. Pad surface temperature is also measured in real-time.
  • January 2015 – Araca introduces new services in the area Through Glass Via (TGV).
  • November 2014 – Araca exhibits and presents at the International Conference on Planarization/CMP Technology 2014 (ICPT 2014), Kobe, Japan.
  • October 2014 – Araca signs up its second high volume manufacturing (HVM) slurry injection system customer (on 25 Applied Materials Reflexion® polishers).
  • September 2014 – Araca signs up its first HVM slurry injection system customer (on 20 Ebara EPO-222® polishers).
  • September 2014 – Araca and SPS-Europe partner to distribute the SIS to selected accounts in Europe and Asia.
  • July 2014 – Phase 2B NSF SBIR grant awarded to Araca for further development and commercialization of the SIS thus bringing the total grant amount from NSF to 1,027,000 USD.
  • May 2014 – 4th round of financing completed.
  • May 2013 – SIS is introduced for the Applied Materials Mirra® polisher.
  • January 2013 – Araca and Semplastics partner to distribute the SIS to selected accounts in the US.
  • December 2012 – Araca joins International SEMATECH Manufacturing Initiative as an associate member for a period of 2 years.
  • December 2012 – Araca introduces the SIS for the Ebara EPO-222® polisher.
  • June 2012 – Araca introduces its latest SIS design for the Applied Materials Reflexion® series of polishers.
  • April 2012 – Phase 2 NSF SBIR grant awarded to Araca for further development and commercialization of the SIS.
  • April 2012 – Araca introduces its novel slurry injection systems for the Ebara F-REX300® and F-REX200® series of polishers.
  • May 2011 – Araca receives Phase 1B NSF SBIR grant for further development of the SIS.
  • January 2011 – Araca receives Phase 1 NSF SBIR grant for the development of the SIS.
  • June 2010 – Araca introduces its novel slurry injection systems for the SpeedFam-IPEC 372® and 472® series of polishers.
  • December 2009 – Joint article by Araca and Intel titled ‘An Analysis of Potential 450 mm CMP Tool Scaling Questions’ is featured as the cover article in the December 2009 issue of the Solid State Technology trade journal.
  • February 2008 – Araca introduces surface preparation and grooving services for 43-inch diameter pads.
  • November 2007 – Araca takes a strategic equity position in InfoNeedle Inc.
  • May 2007 – Araca adds laser confocal microscopy to its list of analytical services.
  • January 2007 – APD-800 is introduced as the world’s first 300-mm polisher capable of real-time measurement, analysis, correlation and reporting of force in three dimensions. Pad surface temperature is also measured in real-time.
  • April 2006 – Hitachi Chemical Co., Ltd, (Tokyo, Japan) takes a strategic equity position in Araca.
  • April 2006 – Fujikoshi Machinery Corporation (Nagano, Japan) takes a further strategic equity position in Araca.
  • April 2006 – 3rd round of financing is completed.
  • April 2006 – Araca Incorporated becomes a Nevada C Corp.
  • December 2005 – APD-500 is introduced as the world’s first 200-mm polisher capable of real-time measurement, analysis, correlation and reporting of force in three dimensions.
  • June 2005 – University of Arizona authorizes and permits Araca the contractual use of UA facilities to further its business objectives.
  • April 2005 – Fujikoshi Machinery Corporation takes a strategic equity position in Araca.
  • April 2005 – 2nd round of financing is completed.
  • March 2005 – Araca completes the acquisition of Intelligent Planar (Mesa, AZ USA).
  • October 2004 – Araca becomes the exclusive sales agent, in North America, of patented surface preparation and pad grooving services provided by Toho Engineering (Mie, Japan).
  • October 2004 – 1st round of financing is completed.
  • September 2004 – Araca Incorporated is founded as a Delaware C Corp operating from its headquarters in Tucson, AZ, USA.