Tel: 520.270.8086 E-mail : araca@aracainc.com

ARACA INCORPORATED

The Polishing and Planarization Experts

Environmentally Focused

Our product offerings provide you with the most non-intrusive way to lower the cost of ownership of your CMP or polishing modules. By working with us, you can save money and do your part in saving the environment by reducing slurry and rinse water consumption, increasing pad and diamond disc life, increasing polisher availability and throughput, and most importantly, increasing yield.

Equipment

The slurry injection system (SIS) is our flagship product. Compatible with most rotary polishers, SIS units are being rapidly adopted in high volume manufacturing due to proven cost of ownership benefits and environmental stewardship. We also provide sensorized and affordable polishers to the CMP and polishing communities that allow for significant reductions in process and consumables research and development costs.

Services

We provide foundry services for substrates of all types and sizes. When testing consumables, we take pride in the quality and the scientific value of our work. Our confocal microscopy, pad surface preparation and grooving, and high-throughput pad dimensional QC services are second to none. We co-develop customized CMP, polishing and cleaning consumables and processes for a variety of applications.

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Bottling the Pad: CMP without Pads or Conditioners

Bottling the Pad: CMP without Pads or Conditioners

Ara Philipossian
  • In conventional CMP, asperities on the pad surface contact the wafer, and with the assistance of polishing with slurry containing chemistry and abrasive particles, remove material from the wafer surface. Because polyurethane (PU) pad asperities are irreversibly deformed due to ..

    Modifying your CMP tool to run 450 mm wafers

    Modifying your CMP tool to run 450 mm wafers

    Ara Philipossian
  • As highlighted in an earlier blog by Dr. Len Borucki, our research team has investigated several key questions resulting from CMP wafer size scale-up by simulating hypothetical 300 and 450 mm processes on rotary polishers. Here, I’d like to describe ..

    CMP at 450 mm: Slurry use and thermal predictions. How did we do?

    CMP at 450 mm: Slurry use and thermal predictions. How did we do?

    Len Borucki
  • The Solid State Technology Article In the December 2009 issue of Solid State Technology, along with my co-authors Ara Philipossian of the University of Arizona and Araca Incorporated, and Michael Goldstein of Intel, I published an article projecting what might ..